Gold Member Since 2016
Yichang Enterprise (Asia) Co., Ltd.

Green Silicon Carbide Semiconductor Industry, Gc Mirco Powder for Semiconductor Industry, Gc Powder for Semiconductor Industry manufacturer / supplier in China, offering Green Silicon Carbide Mirco Powder for Semiconductor Industry, High Quality Brown Alumina for Refractory Rawm Material, Third Grade Brown Fused Alumina for Sandblasting and so on.

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Supplier Homepage Product Green Silicon Carbide Green Silicon Carbide Mirco Powder for Semiconductor Industry

Green Silicon Carbide Mirco Powder for Semiconductor Industry

FOB Price: US $2,600-3,000 / Ton
Min. Order: 1 Ton
Min. Order FOB Price
1 Ton US $2,600-3,000/ Ton
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Port: Tianjin, China
Production Capacity: 20000metric Ton/Year
Payment Terms: L/C, T/T, Western Union

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Basic Info
  • Model NO.: JIS800-JIS2000
  • Application: Metal Parts
  • Source: Artificial Abrasives
  • Hardness: Superabrasive
  • Transport Package: 25 PVC Bag, 1mt/Jumbo Bag
  • Origin: China
  • Artificial Abrasive Type: Silicon Carbide Abrasive
  • Function: Surface Finish
  • Particle Size: Abrasive
  • Trademark: Yichang
  • Specification: JIS800-JIS2000
  • HS Code: 2849200000
Product Description
Green silicon carbide powder 
 
1.Microcosmic shape is a hexagonal crystal, Mohs hardness is 9.3, Vickers hardness is 2940-3300 kg/mm, microhardness is 2670-2815 kg/mm3.
2.Among abrasives, silicon carbide's hardness is higher than corundum, and ranked below diamond, CBN and boron carbide.
3.Density generally viewed is 3.20g/ mm3 , density of heap is 1.2-1.6g/ mm3 , specific gravity is 3.20~3.25.
4.Raw material are petroleum coke and quality silicon sand, appended with salt, then smelted in electric arc furnace. Mechanical strength is higher than corundum.

 Silicon Carbide is characterized by its high wear resistance and good mechanical properties  Its typical characteristics are as following
  Low density and high strength  
  Good resistance to high temperature  
  Good wear resistance and anti-friction properties  
  Excellent resistance to sudden changes in temperature  
  Good chemical resistance and oxidation resistance
  Low thermal expansion and high thermal conductivity (superior to steel)
  Good electrical conductivity

Main applications:
solar wafer, semiconductor wafer and quartz chip wire sawing and lapping; bonded and coated abrasive tools; stone polishing; processing metal and non-ferrous metal with low tensile strength, such as gray pig iron, brass, aluminum, stone, leather and rubber.
 
Particle size comparison of commonly used abrasive
 
 Particle size distribution (micron)Chemical IndexPhysical Index
SizeD3D50D94SiC ≥(%)Fe2O3≤(%)F•C ≤(%)PHValueDensity of heapMagnetic Materials≤(%)
GC#800≤20.014.0±1.0≥9.099.000.200.26--81.180.008
GC#1000≤18.311.5±1.0≥7.098.500.200.26--81.150.008
GC#1200≤17.59.5±0.8≥5.598.500.200.26--81.130.005
GC#1500≤14.58.0±0.6≥4.598.000.200.26--81.120.005
GC#1800≤13.57.0±0.6≥4.298.000.200.26--81.050.005
GC#2000≤13.06.7±0.6≥4.098.000.200.26--81.000.005

  Packaging Detail
25kg/plastic bag, 1mt/wood pallet or as you required. 

Contact Information:
 
 
Tel:          +86 15290880481
 
 
 
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Ms. Cherry Yang
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